Detail publikace

Effect of Annealing on Microstructure and Fatigue Life of UFG Copper

NAVRÁTILOVÁ, L. KUNZ, L. MAN, O. PANTĚLEJEV, L.

Originální název

Effect of Annealing on Microstructure and Fatigue Life of UFG Copper

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

The influence of annealing of ultrafine-grained copper prepared by equal channel angular pressing on its fatigue life was experimentally determined. The fatigue loading was carried out with tensile mean stress of 200 MPa. The microstructure was examined by means of transmission electron microscopy and by means of electron back scattering diffraction. Annealing was found to result in development of bimodal microstructure. The fatigue performance of this structure is worth than that of original ultrafine-grained structure.

Klíčová slova

UFG copper, ECAP, annealing, fatigue behaviour, mean stress

Autoři

NAVRÁTILOVÁ, L.; KUNZ, L.; MAN, O.; PANTĚLEJEV, L.

Rok RIV

2009

Vydáno

13. 7. 2009

Nakladatel

University of Žilina

Místo

Žilina

ISSN

1335-0803

Periodikum

Materiálové inžinierstvo

Ročník

XVI

Číslo

3a

Stát

Slovenská republika

Strany od

28

Strany do

31

Strany počet

4

BibTex

@article{BUT49173,
  author="Lucie {Navrátilová} and Ludvík {Kunz} and Ondřej {Man} and Libor {Pantělejev}",
  title="Effect of Annealing on Microstructure and Fatigue Life of UFG Copper",
  journal="Materiálové inžinierstvo",
  year="2009",
  volume="XVI",
  number="3a",
  pages="28--31",
  issn="1335-0803"
}