Detail publikace

Numerical investigation of stress singularities in cracked bimaterial body

NÁHLÍK, L. ŠESTÁKOVÁ, L. HUTAŘ, P.

Originální název

Numerical investigation of stress singularities in cracked bimaterial body

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

Composite materials or generally materials with interfaces are nowadays used in many varied engineering applications. In comparison with classical engineering materials the existence of material interface causes locally different stress distribution, which can strongly influence behaviour of whole structure and can have an important influence on failure mechanisms of such materials. The paper presented is devoted to the investigation of stress singularity exponents of a crack growing in a bimaterial body perpendicularly to the interface and touching the material interface. Discrepancies between value of stress singularity exponent in the centre of bimaterial body and on the free surface were found. The assumptions of linear elastic fracture mechanics (LEFM) and small scale yielding (SSY) are considered. For numerical calculations finite element analysis was used. Results obtained can contribute to a better understanding of failure of materials with interfaces.

Klíčová slova

bimaterial interface, stress singularity exponent, corner singularity, vertex singularity, general singular stress concentrator

Autoři

NÁHLÍK, L.; ŠESTÁKOVÁ, L.; HUTAŘ, P.

Rok RIV

2008

Vydáno

2. 7. 2008

Nakladatel

Trans Tech Publications

Místo

Switzerland

ISSN

1013-9826

Periodikum

Key Engineering Materials (print)

Ročník

385-387

Číslo

385-387

Stát

Švýcarská konfederace

Strany od

125

Strany do

128

Strany počet

4

BibTex

@article{BUT48865,
  author="Luboš {Náhlík} and Lucie {Malíková} and Pavel {Hutař}",
  title="Numerical investigation of stress singularities in cracked bimaterial body",
  journal="Key Engineering Materials (print)",
  year="2008",
  volume="385-387",
  number="385-387",
  pages="125--128",
  issn="1013-9826"
}