Detail publikace

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

Originální název

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

Anglický název

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

Jazyk

en

Originální abstrakt

deals with influence of lead-free thick film conductive materials on wire bonding

Anglický abstrakt

deals with influence of lead-free thick film conductive materials on wire bonding

BibTex


@inproceedings{BUT28357,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Marek {Novotný}",
  title="Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability",
  annote="deals with influence of lead-free thick film conductive materials on  wire bonding",
  address="TU Dresden",
  booktitle="Proceedings ISSE 2007",
  chapter="28357",
  institution="TU Dresden",
  year="2007",
  month="may",
  pages="124--129",
  publisher="TU Dresden",
  type="conference paper"
}