Detail publikace

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Originální název

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Anglický název

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Jazyk

en

Originální abstrakt

study of wire bonding connection for power chips

Anglický abstrakt

study of wire bonding connection for power chips

BibTex


@inproceedings{BUT28219,
  author="Ivan {Szendiuch} and Marek {Novotný} and Zdeněk {Bartoň}",
  title="Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections",
  annote="study of wire bonding connection for power chips",
  booktitle="Proceedings IDT'07",
  chapter="28219",
  year="2007",
  month="october",
  pages="242--245",
  type="conference paper"
}