Detail publikace

Finite Element Modeling of Surface Mount Devices

Originální název

Finite Element Modeling of Surface Mount Devices

Anglický název

Finite Element Modeling of Surface Mount Devices

Jazyk

en

Originální abstrakt

The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

Anglický abstrakt

The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

BibTex


@inproceedings{BUT17411,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Finite Element Modeling of Surface Mount Devices",
  annote="The aim of this work is to improve reliability of SMD connecting and to increase
durability of these structures. Three-dimensional finite element analysis has been applied to determine
the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions
(-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in
solder joint under shearing. This paper describes recent developments made to the finite element
modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the
validation of this approach and results obtained for an SMD. Lifetime predictions are made using the
creep strain energy based models of Darveaux. This study discusses the analysis methodologies as
implemented in the ANSYS finite element simulation software tool.",
  address="TU Wien",
  booktitle="Proceedings of ISSE 2005",
  chapter="17411",
  institution="TU Wien",
  year="2005",
  month="january",
  pages="97",
  publisher="TU Wien",
  type="conference paper"
}