Detail publikace

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Originální název

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Anglický název

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Jazyk

en

Originální abstrakt

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Anglický abstrakt

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

BibTex


@inproceedings{BUT14828,
  author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling",
  annote="This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.",
  address="IMAPS BENELUX",
  booktitle="15th European Microelectronics and Packaging Conference & Exhibition",
  chapter="14828",
  institution="IMAPS BENELUX",
  year="2005",
  month="january",
  pages="546",
  publisher="IMAPS BENELUX",
  type="conference paper"
}