Detail publikace

Lead Free Solder Material Compatibility and Technological Factors

Originální název

Lead Free Solder Material Compatibility and Technological Factors

Anglický název

Lead Free Solder Material Compatibility and Technological Factors

Jazyk

en

Originální abstrakt

This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study

Anglický abstrakt

This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study

Dokumenty

BibTex


@inproceedings{BUT14428,
  author="Jiří {Starý} and Ivan {Szendiuch}",
  title="Lead Free Solder Material Compatibility and Technological Factors",
  annote="This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study",
  booktitle="Conference Proceedings ISSE 2005",
  chapter="14428",
  year="2005",
  month="january",
  pages="78",
  type="conference paper"
}