Detail publikace

Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites

MAJER, Z. NÁHLÍK, L. ŠTEGNEROVÁ, K. HUTAŘ, P. BERMEJO, R.

Originální název

Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The aim of the present work is to analyze the influence of residual stresses in the particulate ceramic composite on the crack propagation. The crack propagation direction was estimated using Sih’s criterion based on the strain energy density factor. A two-dimensional finite element model was developed for determination of crack path. The residual stresses resulting from the mismatch of coefficients of thermal expansion during the fabrication process of the composite were implemented to the computational model. The effect of the particles shape on the crack propagation was investigated. Conclusions of this paper can contribute to a better understanding of the propagation of micro-cracks in particulate composites in the field of residual stresses.

Klíčová slova

residual stresses, particulate ceramic composite, crack propagation, shielding effect

Autoři

MAJER, Z.; NÁHLÍK, L.; ŠTEGNEROVÁ, K.; HUTAŘ, P.; BERMEJO, R.

Vydáno

2. 1. 2017

Nakladatel

Trans Tech Publications Inc.

Místo

Zürrich, Switzerland

ISBN

978-3-03835-626-4

Kniha

MSMF8. International Conference on Materials Structure and Micromechanics of Fracture

Edice

8

ISSN

1662-9779

Periodikum

Solid State Phenomena

Číslo

258

Stát

Švýcarská konfederace

Strany od

178

Strany do

181

Strany počet

4

URL

BibTex

@inproceedings{BUT141076,
  author="Zdeněk {Majer} and Luboš {Náhlík} and Kateřina {Štegnerová} and Pavel {Hutař} and Raul {Bermejo}",
  title="Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites",
  booktitle="MSMF8. International Conference on Materials Structure and Micromechanics of Fracture",
  year="2017",
  series="8",
  journal="Solid State Phenomena",
  number="258",
  pages="178--181",
  publisher="Trans Tech Publications Inc.",
  address="Zürrich, Switzerland",
  doi="10.4028/www.scientific.net/SSP.258.178",
  isbn="978-3-03835-626-4",
  issn="1662-9779",
  url="https://www.scientific.net/SSP.258.178"
}