Detail publikace
Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
STARÝ, J., KAZELLE, J.
Originální název
Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
Anglický název
Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
Jazyk
en
Originální abstrakt
Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:
Anglický abstrakt
Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:
Dokumenty
BibTex
@inproceedings{BUT12623,
author="Jiří {Starý} and Jiří {Kazelle}",
title="Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere",
annote="Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect.
These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:
",
address="MPO",
booktitle="3rd European Microelectronics and Packaging Symposium",
chapter="12623",
institution="MPO",
year="2004",
month="september",
pages="589",
publisher="MPO",
type="conference paper"
}