Detail publikace

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

STARÝ, J., KAZELLE, J.

Originální název

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:

Klíčová slova

lead free, solderability, wettability, surface finish, flux, nitrogen, forming gas

Autoři

STARÝ, J., KAZELLE, J.

Rok RIV

2004

Vydáno

9. 9. 2004

Nakladatel

MPO

Místo

Praha

ISBN

80-239-2835-X

Kniha

3rd European Microelectronics and Packaging Symposium

Strany od

589

Strany do

595

Strany počet

7

BibTex

@inproceedings{BUT12623,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere",
  booktitle="3rd European Microelectronics and Packaging Symposium",
  year="2004",
  pages="7",
  publisher="MPO",
  address="Praha",
  isbn="80-239-2835-X"
}