Detail publikace

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

Originální název

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

Anglický název

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

Jazyk

en

Originální abstrakt

Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:

Anglický abstrakt

Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:

BibTex 


@inproceedings{BUT12623,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere",
  annote="Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect.
These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:

",
  address="MPO",
  booktitle="3rd European Microelectronics and Packaging Symposium",
  chapter="12623",
  institution="MPO",
  year="2004",
  month="september",
  pages="589",
  publisher="MPO",
  type="conference paper"
}