Detail publikace

Some New Results from Investigation of Lead-free Solders Application

Originální název

Some New Results from Investigation of Lead-free Solders Application

Anglický název

Some New Results from Investigation of Lead-free Solders Application

Jazyk

en

Originální abstrakt

This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment and RoHS – Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn’t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated in this context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and optimized soldering process settings. System SnAgCu, which is actually the most popular, was used permanent to compare it with SnPb. Aim of this paper is to give some more experience in involving of Pb-free solder in the practical use including to indicate the simple approach to wettability testing. Inert/inert-reduction atmosphere have to improve solder process yield effect.

Anglický abstrakt

This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment and RoHS – Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn’t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated in this context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and optimized soldering process settings. System SnAgCu, which is actually the most popular, was used permanent to compare it with SnPb. Aim of this paper is to give some more experience in involving of Pb-free solder in the practical use including to indicate the simple approach to wettability testing. Inert/inert-reduction atmosphere have to improve solder process yield effect.

BibTex


@inproceedings{BUT12487,
  author="Ivan {Szendiuch} and Jiří {Starý}",
  title="Some New Results from Investigation of Lead-free Solders Application",
  annote="This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment and RoHS – Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn’t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated in this context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and optimized soldering process settings. System SnAgCu, which is actually the most popular, was used permanent to compare it with SnPb. Aim of this paper is to give some more experience in involving of Pb-free solder in the practical use including to indicate the simple approach to wettability testing.  Inert/inert-reduction atmosphere have to improve solder process yield effect.

 
",
  address="IMAPS Nordic",
  booktitle="Proceedings of IMAPS Nordic 2004 Annual Conference",
  chapter="12487",
  institution="IMAPS Nordic",
  year="2004",
  month="september",
  pages="49",
  publisher="IMAPS Nordic",
  type="conference paper"
}