Detail publikace

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Originální název

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Anglický název

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Jazyk

en

Originální abstrakt

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

Anglický abstrakt

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

BibTex


@inproceedings{BUT124490,
  author="Alexandr {Otáhal} and Adam {Crha} and Václav {Šimek} and Richard {Růžička} and Ivan {Szendiuch}",
  title="ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING",
  annote="This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  chapter="124490",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  year="2016",
  month="april",
  pages="610--614",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  type="conference paper"
}