Detail publikace

Temperature Stabilized Chip Expander

Originální název

Temperature Stabilized Chip Expander

Anglický název

Temperature Stabilized Chip Expander

Jazyk

en

Originální abstrakt

For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins. Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4). The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

Anglický abstrakt

For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins. Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4). The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

BibTex


@inproceedings{BUT119865,
  author="Michal {Řezníček} and Martin {Buršík} and Jaroslav {Jankovský} and Václav {Šimek} and Richard {Růžička}",
  title="Temperature Stabilized Chip Expander",
  annote="For measurements and testing of experimental semiconductor structures there
raises a problem with the connection between the chip and the measuring circuit.
Our proposed chip expander provides the function of the carrier substrate (Al2O3)
with CTE compatibility to experimental silicon chip. It also allows expansion of
terminals chip into a larger area. Interconnection between the chip and the
conductive topology realized on a carrier substrate is realized by wire bonding
(gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement
system is connected either the standard soldered pins or through precision gold
plated SIP socket pins.

Very flat planar configuration of the chip expander allows you to work in very
small chambers such as the AFM microscopes, etc. Another significant advantage of
expander chip is also the possibility of its own temperature stabilization
through the heating element located on the reverse side. This chip expander is
thanks to its CTE and possibilities of flexible leads (gull-wing) can also be
used as an adapter for mounting of large semiconductor chips into ordinary test
boards (FR4).

The article discusses the use of chip expanders in the context of polymorphic
chips experiments. In this case chip expander with mounted polymorphic chip are
thermally stabilized at a temperature range from ambient temperature to 120 ° C.
Polymorphic circuits can be considered as multifunctional circuits that change of
their behavior comes from modifications in the characteristic of components
involved in the circuit in response to controls temperature.",
  address="IMAPS-Deutschland e.V.",
  booktitle="Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition",
  chapter="119865",
  doi="10.13140/RG.2.1.1154.4084",
  edition="NEUVEDEN",
  howpublished="electronic, physical medium",
  institution="IMAPS-Deutschland e.V.",
  year="2015",
  month="september",
  pages="1--6",
  publisher="IMAPS-Deutschland e.V.",
  type="conference paper"
}