Detail publikace

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

ŠTUMPF, M.

Originální název

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

Anglický název

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

Jazyk

en

Originální abstrakt

The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.

Anglický abstrakt

The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.

Dokumenty

BibTex


@article{BUT101999,
  author="Martin {Štumpf}",
  title="The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits",
  annote="The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.",
  address="IEEE Press",
  chapter="101999",
  doi="10.1109/TEMC.2013.2280297",
  institution="IEEE Press",
  number="2",
  volume="56",
  year="2014",
  month="march",
  pages="367--374",
  publisher="IEEE Press",
  type="journal article in Web of Science"
}