Detail publikace
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
ŠTUMPF, M.
Originální název
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
Anglický název
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
Jazyk
en
Originální abstrakt
The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.
Anglický abstrakt
The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.
Dokumenty
BibTex
@article{BUT101999,
author="Martin {Štumpf}",
title="The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits",
annote="The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.",
address="IEEE Press",
chapter="101999",
doi="10.1109/TEMC.2013.2280297",
institution="IEEE Press",
number="2",
volume="56",
year="2014",
month="march",
pages="367--374",
publisher="IEEE Press",
type="journal article in Web of Science"
}