Detail publikace

Polyethylenterepthalate surface pretreatment

CHMELA, O. STARÝ, J. ŠUBARDA, J. ČUDEK, P. PRÁŠEK, J. ČÍŽEK, J.

Originální název

Polyethylenterepthalate surface pretreatment

Anglický název

Polyethylenterepthalate surface pretreatment

Jazyk

en

Originální abstrakt

Polyethylenterepthalate (PET) pretreatment is one of the most important steps for reliable copper conductive structure realization. Two types of pretreatments were tested. Chemical pretreatment with NaOH and physical pretreatment with plasma. Thin copper layer on PET surface was realized with cathode Cu sputtering. Photolithography techniques were used for preparing open areas for electrochemical copper plating and than differential Cu etching for conductive structures formation. Properties of pretreatments were evaluated with different methods: AFM, contact angle measurement, surface energies calculation and scratch test.

Anglický abstrakt

Polyethylenterepthalate (PET) pretreatment is one of the most important steps for reliable copper conductive structure realization. Two types of pretreatments were tested. Chemical pretreatment with NaOH and physical pretreatment with plasma. Thin copper layer on PET surface was realized with cathode Cu sputtering. Photolithography techniques were used for preparing open areas for electrochemical copper plating and than differential Cu etching for conductive structures formation. Properties of pretreatments were evaluated with different methods: AFM, contact angle measurement, surface energies calculation and scratch test.

Dokumenty

BibTex 


@proceedings{BUT101211,
  author="Ondřej {Chmela} and Jiří {Starý} and Jiří {Šubarda} and Pavel {Čudek} and Jan {Prášek} and Jan {Čížek}",
  title="Polyethylenterepthalate surface pretreatment",
  annote="Polyethylenterepthalate (PET) pretreatment is one of the most important steps for reliable copper conductive structure realization. Two types of pretreatments were tested. Chemical pretreatment with NaOH and physical pretreatment with plasma. Thin copper layer on PET surface was realized with cathode Cu sputtering. Photolithography techniques were used for preparing open areas for electrochemical copper plating and than differential Cu etching for conductive structures formation. Properties of pretreatments were evaluated with different methods: AFM, contact angle measurement, surface energies calculation and scratch test.",
  address="Vysoké učení technické v Brně",
  booktitle="Electronic Devices and Systems, IMAPS CS International Conference 2013",
  chapter="101211",
  edition="1",
  howpublished="print",
  institution="Vysoké učení technické v Brně",
  year="2013",
  month="june",
  pages="205--209",
  publisher="Vysoké učení technické v Brně",
  type="conference proceedings"
}