Detail publikace

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

ŠANDERA, J.

Originální název

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS

Klíčová slova v angličtině

Interconnection failure, FEM, Thermomechanical stress, Darveaux s methodology, the viscoplastic strain energy density, stacked structure FR4-ceramic,power cycling procedure

Autoři

ŠANDERA, J.

Rok RIV

2003

Vydáno

20. 9. 2003

Nakladatel

Brno University of Technology

Místo

Brno University of Technology

ISBN

80-214-2452-4

Kniha

Electronic Devices and Systems 2003 - Proceedins

Edice

Brno University of Technology

Strany od

394

Strany do

397

Strany počet

4

BibTex

@inproceedings{BUT9412,
  author="Josef {Šandera}",
  title="Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate",
  booktitle="Electronic Devices and Systems 2003 - Proceedins",
  year="2003",
  series="Brno University of Technology",
  pages="4",
  publisher="Brno University of Technology",
  address="Brno University of Technology",
  isbn="80-214-2452-4"
}