Detail publikace

Thermomechanical Modelling of Multisubstrate Modules

BÍLEK, J.

Originální název

Thermomechanical Modelling of Multisubstrate Modules

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

As today’s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from several ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates.

Klíčová slova

ANSYS modelling, MSM, thermomechanical properties

Autoři

BÍLEK, J.

Rok RIV

2002

Vydáno

9. 9. 2002

Nakladatel

Ing.Zdeněk Novotný, CSc., Brno

Místo

Brno

ISBN

80-214-2180-0

Kniha

Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission

Číslo edice

1

Strany od

230

Strany do

233

Strany počet

4

BibTex

@inproceedings{BUT4776,
  author="Jaromír {Bílek}",
  title="Thermomechanical Modelling of Multisubstrate Modules",
  booktitle="Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission",
  year="2002",
  number="1",
  pages="4",
  publisher="Ing.Zdeněk Novotný, CSc., Brno",
  address="Brno",
  isbn="80-214-2180-0"
}