Detail publikace

ANSYS Thermal Modelling of Thick Film Structures

BÍLEK, J.

Originální název

ANSYS Thermal Modelling of Thick Film Structures

Anglický název

ANSYS Thermal Modelling of Thick Film Structures

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper focuses on the mathematical modelling in thick film applications using ANSYS software. The creation of the model and simplifications made during the process are described and discussed, theory of the thermal modelling is briefly introduced. A comparison between the model and measurements using an infrared camera is also presented and recommendations for other possible thermal analyses are given.

Klíčová slova

thick film, modelling, ANSYS

Klíčová slova v angličtině

thick film, modelling, ANSYS

Autoři

BÍLEK, J.

Vydáno

25. 4. 2002

Nakladatel

FEI VUT Brno

Místo

Brno

ISBN

80-214-2115-0

Kniha

Proceeding of 8th conference STUDENT EEICT 2002

Číslo edice

1

Strany od

193

Strany do

197

Strany počet

5

BibTex

@inproceedings{BUT4606,
  author="Jaromír {Bílek}",
  title="ANSYS Thermal Modelling of Thick Film Structures",
  booktitle="Proceeding of 8th conference STUDENT EEICT 2002",
  year="2002",
  number="1",
  pages="5",
  publisher="FEI VUT Brno",
  address="Brno",
  isbn="80-214-2115-0"
}