Detail publikace

Modelling of 3D Multisubstrate Structures

BULVA, J.

Originální název

Modelling of 3D Multisubstrate Structures

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Klíčová slova v angličtině

ANSYS, MSM, modelling, thermomechanical properties

Autoři

BULVA, J.

Rok RIV

2003

Vydáno

24. 11. 2003

ISSN

1213-161X

Periodikum

ElectronicsLetters.com - http://www.electronicsletters.com

Ročník

2003

Číslo

4/11

Stát

Česká republika

Strany od

1

Strany do

1

Strany počet

1

BibTex

@article{BUT41317,
  author="Jindřich {Bulva}",
  title="Modelling of 3D Multisubstrate Structures",
  journal="ElectronicsLetters.com - http://www.electronicsletters.com",
  year="2003",
  volume="2003",
  number="4/11",
  pages="1",
  issn="1213-161X"
}