Detail publikace
Testing and Simulation of Wire Bonding Attach for higher Current
BURŠÍK, M. NOVOTNÝ, M. JANKOVSKÝ, J. HEJÁTKOVÁ, E. SZENDIUCH, I.
Originální název
Testing and Simulation of Wire Bonding Attach for higher Current
Anglický název
Testing and Simulation of Wire Bonding Attach for higher Current
Jazyk
en
Originální abstrakt
This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.
Anglický abstrakt
This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.
Dokumenty
BibTex
@inproceedings{BUT35243,
author="Martin {Buršík} and Marek {Novotný} and Jaroslav {Jankovský} and Edita {Hejátková} and Ivan {Szendiuch}",
title="Testing and Simulation of Wire Bonding Attach for higher Current",
annote="This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for
standard CMOS technology.",
booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
chapter="35243",
edition="1",
howpublished="electronic, physical medium",
year="2010",
month="september",
pages="1--4",
type="conference paper"
}