Detail publikace

Testing and Simulation of Wire Bonding Attach for higher Current

BURŠÍK, M. NOVOTNÝ, M. JANKOVSKÝ, J. HEJÁTKOVÁ, E. SZENDIUCH, I.

Originální název

Testing and Simulation of Wire Bonding Attach for higher Current

Anglický název

Testing and Simulation of Wire Bonding Attach for higher Current

Jazyk

en

Originální abstrakt

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

Anglický abstrakt

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

Dokumenty

BibTex 


@inproceedings{BUT35243,
  author="Martin {Buršík} and Marek {Novotný} and Jaroslav {Jankovský} and Edita {Hejátková} and Ivan {Szendiuch}",
  title="Testing and Simulation of Wire Bonding Attach for higher Current",
  annote="This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for
standard CMOS technology.",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  chapter="35243",
  edition="1",
  howpublished="electronic, physical medium",
  year="2010",
  month="september",
  pages="1--4",
  type="conference paper"
}