Detail publikace

Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper

BUKSA, M. KUNZ, L. WANG, Q.

Originální název

Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

It has been indicated in literature that the reason for different fatigue lifetime of UFG materials should be sought in the details of the ECAP process, purity and microstructure stability. The aim of this study is to contribute to deeper understanding of the influence of details of the ECAP process and material purity on fatigue strength of UFG Cu.

Klíčová slova

ECAP process, fatigue lifetime, UFG Cu, influence of details, purity

Autoři

BUKSA, M.; KUNZ, L.; WANG, Q.

Rok RIV

2007

Vydáno

25. 6. 2007

Nakladatel

Žilinská univerzita

Místo

Žilina

ISBN

978-80-8070-695-1

Kniha

Transcom 2007

Strany od

49

Strany do

52

Strany počet

4

BibTex

@inproceedings{BUT28970,
  author="Michal {Buksa} and Ludvík {Kunz} and Qingjuan {Wang}",
  title="Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper",
  booktitle="Transcom 2007",
  year="2007",
  pages="49--52",
  publisher="Žilinská univerzita",
  address="Žilina",
  isbn="978-80-8070-695-1"
}