Detail publikace

Contact Resonance Imaging with Vertical Nanowire Arrays

FAHRBACH, M. JIUSHAI, X. KLAPETEK, P. MARTINEK, J. PEINER, E.

Originální název

Contact Resonance Imaging with Vertical Nanowire Arrays

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

A setup for high-throughput measurement of dimensional and mechanical parameters of silicon microwire and resist microwire arrays is used for combined topography and contact resonance imaging. It is based on customized long slander piezoresistive silicon microprobes designed for in-line measurements of industrial workpieces. In measurements with microwire and nanowire arrays we found sub-micrometer resolution on large areas (300umx300um) at high speed up to 300 um/s. Using a mass-spring model, characteristic features of contact resonance imaging with slender microprobes were simulated.

Klíčová slova

modal analysis, finite element method, ultrasonic testing, fundamental frequency

Autoři

FAHRBACH, M.; JIUSHAI, X.; KLAPETEK, P.; MARTINEK, J.; PEINER, E.

Vydáno

11. 5. 2022

Nakladatel

AMA Service GmbH

Místo

Nuremberg

ISBN

9783800758364

Kniha

Sensoren und Messsysteme - 21. ITG/GMA Fachtagung

Edice

1.

Strany od

245

Strany do

250

Strany počet

6

BibTex

@inproceedings{BUT182522,
  author="Michael {Fahrbach} and xu {jiushai} and Petr {Klapetek} and Jan {Martinek} and Erwin {Peiner}",
  title="Contact Resonance Imaging with Vertical Nanowire Arrays",
  booktitle="Sensoren und Messsysteme - 21. ITG/GMA Fachtagung",
  year="2022",
  series="1.",
  pages="245--250",
  publisher="AMA Service GmbH",
  address="Nuremberg",
  isbn="9783800758364"
}