Detail publikace

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Shabanov, N.S. Rabadanov, K.S. Suleymanov, S.I. Amirov, A.M. Isaev, A.B. Sobola, D.S. Murliev, E.K. Asvarova, G.A.

Originální název

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

Klíčová slova

organometallic compound; conductivity; thermogravimetry

Autoři

Shabanov, N.S.; Rabadanov, K.S.; Suleymanov, S.I.; Amirov, A.M.; Isaev, A.B.; Sobola, D.S.; Murliev, E.K.; Asvarova, G.A.

Vydáno

26. 4. 2021

Nakladatel

MDPI

Místo

BASEL

ISSN

1996-1944

Periodikum

Materials

Ročník

14

Číslo

9

Stát

Švýcarská konfederace

Strany od

1

Strany do

12

Strany počet

12

URL

Plný text v Digitální knihovně

BibTex

@article{BUT171356,
  author="Shabanov {Nabi} and Kamil {Rabadanov} and Sagim {Suleimanov} and Akhmed {Amirov} and Abdulgalim {Isaev} and Dinara {Sobola} and Eldar {Murliev} and Gulnara {Asvarova}",
  title="Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components",
  journal="Materials",
  year="2021",
  volume="14",
  number="9",
  pages="1--12",
  doi="10.3390/ma14092218",
  issn="1996-1944",
  url="https://www.mdpi.com/1996-1944/14/9/2218/htm"
}