Detail publikace

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

BÚRAN, M. ŘEZNÍČEK, M.

Originální název

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Klíčová slova

wire bonding, reliability, mechanical strength, current

Autoři

BÚRAN, M.; ŘEZNÍČEK, M.

Vydáno

14. 5. 2020

Nakladatel

IEEE

ISBN

978-1-7281-6773-2

Kniha

43nd International Spring Seminar on Electronics Technology (ISSE).

ISSN

2161-2536

Periodikum

International Spring Seminar on Electronics Technology ISSE

Stát

Spojené státy americké

Strany od

1

Strany do

4

Strany počet

4

URL

https://ieeexplore.ieee.org/document/9120937

BibTex

@inproceedings{BUT164782,
  author="Martin {Búran} and Michal {Řezníček}",
  title="The Analysis of Wire Bonding Reliability under Critical Operating Conditions",
  booktitle="43nd International Spring Seminar on Electronics Technology (ISSE).",
  year="2020",
  journal="International Spring Seminar on Electronics Technology ISSE",
  pages="1--4",
  publisher="IEEE",
  doi="10.1109/ISSE49702.2020.9120937",
  isbn="978-1-7281-6773-2",
  issn="2161-2536",
  url="https://ieeexplore.ieee.org/document/9120937"
}