Detail publikace

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

BÚRAN, M. ŘEZNÍČEK, M.

Originální název

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Anglický název

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Jazyk

en

Originální abstrakt

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Anglický abstrakt

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Dokumenty

BibTex


@inproceedings{BUT164782,
  author="Martin {Búran} and Michal {Řezníček}",
  title="The Analysis of Wire Bonding Reliability under Critical Operating Conditions",
  annote="This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.",
  address="IEEE",
  booktitle="43nd International Spring Seminar on Electronics Technology (ISSE).",
  chapter="164782",
  doi="10.1109/ISSE49702.2020.9120937",
  howpublished="online",
  institution="IEEE",
  year="2020",
  month="may",
  pages="1--4",
  publisher="IEEE",
  type="conference paper"
}