Detail publikace

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

VALA, R. STARČOK, T.

Originální název

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Český název

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Typ

článek ve sborníku

Jazyk

cs

Originální abstrakt

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Český abstrakt

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Klíčová slova

BGA, solder, residues, rework

Vydáno

28.04.2016

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo

Brno

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference Student EEICT 2016

Strany od

237

Strany do

239

Strany počet

777

BibTex


@inproceedings{BUT127137,
  author="Radek {Vala} and Tomáš {Starčok}",
  title="STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA",
  annote="This paper deals with issues connected with solder residues cleaning process of modern
BGA packages. First part is focused on contact cleaning method of solder residues. It describes
main disadvantages and incurred defects of this method. Second part is focused on a new contactless
cleaning method with special tool and then suggests variety of verification possibilities.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  chapter="127137",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  year="2016",
  month="april",
  pages="237--239",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  type="conference paper"
}