Detail publikace

Innovative Methods for Through Holes Plating

Originální název

Innovative Methods for Through Holes Plating

Anglický název

Innovative Methods for Through Holes Plating

Jazyk

en

Originální abstrakt

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Anglický abstrakt

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

BibTex 


@inproceedings{BUT126050,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods for Through Holes Plating",
  annote="The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.",
  address="University of West Bohemia",
  booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
  chapter="126050",
  doi="10.1109/ISSE.2016.7563159",
  howpublished="online",
  institution="University of West Bohemia",
  year="2016",
  month="may",
  pages="48--52",
  publisher="University of West Bohemia",
  type="conference paper"
}