Detail publikace
Innovative Methods for Through Holes Plating
Originální název
Innovative Methods for Through Holes Plating
Anglický název
Innovative Methods for Through Holes Plating
Jazyk
en
Originální abstrakt
The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.
Anglický abstrakt
The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.
BibTex
@inproceedings{BUT126050,
author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
title="Innovative Methods for Through Holes Plating",
annote="The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.",
address="University of West Bohemia",
booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
chapter="126050",
doi="10.1109/ISSE.2016.7563159",
howpublished="online",
institution="University of West Bohemia",
year="2016",
month="may",
pages="48--52",
publisher="University of West Bohemia",
type="conference paper"
}