Detail publikace

The Analysis of Solder Preforms in Surface Mount Assembly

Originální název

The Analysis of Solder Preforms in Surface Mount Assembly

Anglický název

The Analysis of Solder Preforms in Surface Mount Assembly

Jazyk

en

Originální abstrakt

This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.

Anglický abstrakt

This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.

BibTex


@inproceedings{BUT124794,
  author="Václav {Novotný} and Josef {Šandera} and Radek {Vala}",
  title="The Analysis of Solder Preforms in Surface Mount Assembly",
  annote="This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  chapter="124794",
  howpublished="print",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  year="2016",
  month="may",
  pages="685--689",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  type="conference paper"
}