Detail publikace

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Originální název

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Anglický název

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Jazyk

en

Originální abstrakt

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYS and the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimental measurements and these are compared and analyzed.

Anglický abstrakt

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYS and the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimental measurements and these are compared and analyzed.

BibTex


@inproceedings{BUT119642,
  author="Václav {Novotný} and Josef {Šandera}",
  title="RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD",
  annote="This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4  and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYS and the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimental measurements and these are compared and analyzed.",
  address="Tanger, Ltd.",
  booktitle="Nanocon 2015 Conference proceedings",
  chapter="119642",
  howpublished="print",
  institution="Tanger, Ltd.",
  year="2015",
  month="october",
  pages="1--1",
  publisher="Tanger, Ltd.",
  type="conference paper"
}