Detail publikace

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

SKÁCEL, J. SZENDIUCH, I.

Originální název

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

Český název

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

Typ

článek ve sborníku

Jazyk

cs

Originální abstrakt

This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.

Český abstrakt

This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.

Klíčová slova

ANSYS, BGA, QFN, thermo-mechanical behavior

Rok RIV

2015

Vydáno

23.04.2015

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Místo

Brno

ISBN

978-80-214-5148-3

Kniha

Proceedings of the 21st Conference STUDENT EEICT 2015

Strany od

289

Strany do

291

Strany počet

3

URL

BibTex


@inproceedings{BUT117506,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="THERMOMECHANICAL SIMULATION OF MODERN
ELECTRONIC PACKAGES",
  annote="This paper deals with issue of modern electronic packages mainly thermo-mechanical
simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball
Grid Array) packages including their advantages and disadvantages. The second part is focused on
simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  chapter="117506",
  howpublished="online",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  year="2015",
  month="april",
  pages="289--291",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  type="conference paper"
}