Detail publikace

Bonding of LTCC with Alumina ceramics

Originální název

Bonding of LTCC with Alumina ceramics

Anglický název

Bonding of LTCC with Alumina ceramics

Jazyk

en

Originální abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.

Anglický abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.

BibTex


@inproceedings{BUT108122,
  author="Jakub {Somer} and Michal {Štekovič} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of LTCC with Alumina ceramics",
  annote="Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.",
  address="Vysoké učení technické v Brně",
  booktitle="Electronic Devices and Systems, IMAPS CS International Conference 2014",
  chapter="108122",
  howpublished="print",
  institution="Vysoké učení technické v Brně",
  year="2014",
  month="june",
  pages="60--64",
  publisher="Vysoké učení technické v Brně",
  type="conference paper"
}