Detail publikace

Testing of Novel Device for Anodic Bonding process in MEMS Application

PEKÁREK, J. VRBA, R. MAGÁT, M. PAVLÍK, M. HÁZE, J.

Originální název

Testing of Novel Device for Anodic Bonding process in MEMS Application

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass

Klíčová slova

Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test.

Autoři

PEKÁREK, J.; VRBA, R.; MAGÁT, M.; PAVLÍK, M.; HÁZE, J.

Rok RIV

2011

Vydáno

16. 9. 2011

Nakladatel

Faculty of Electronic Engineering and Technologies, Technical University of Sofia

Místo

Sofia

ISSN

1313-1842

Periodikum

Electronics

Ročník

5

Číslo

2

Stát

Bulharská republika

Strany od

180

Strany do

182

Strany počet

3

BibTex

@article{BUT73584,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát} and Michal {Pavlík} and Jiří {Háze}",
  title="Testing of Novel Device for Anodic Bonding process in MEMS Application",
  journal="Electronics",
  year="2011",
  volume="5",
  number="2",
  pages="180--182",
  issn="1313-1842"
}