Detail publikace

Mechanical Stress of Chip SMD Components with Ceramic Body

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Mechanical Stress of Chip SMD Components with Ceramic Body

Anglický název

Mechanical Stress of Chip SMD Components with Ceramic Body

Jazyk

en

Originální abstrakt

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

Anglický abstrakt

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

Dokumenty

BibTex


@inproceedings{BUT9561,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Mechanical Stress of Chip SMD Components with Ceramic Body",
  annote="The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.",
  booktitle="Electronic Devices and Systems",
  chapter="9561",
  year="2003",
  month="september",
  pages="398",
  type="conference paper"
}