Detail publikace

Possibilities of making 3D resistors in LTCC technology

KLÍMA, M. SZENDIUCH, I.

Originální název

Possibilities of making 3D resistors in LTCC technology

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.

Klíčová slova

LTCC, 3D resistor, resistive vias

Autoři

KLÍMA, M.; SZENDIUCH, I.

Rok RIV

2012

Vydáno

20. 8. 2012

ISBN

978-1-4673-2240-9

Kniha

Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology

Strany od

50

Strany do

54

Strany počet

5

BibTex

@inproceedings{BUT93108,
  author="Martin {Klíma} and Ivan {Szendiuch}",
  title="Possibilities of making 3D resistors in LTCC technology",
  booktitle="Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology",
  year="2012",
  pages="50--54",
  isbn="978-1-4673-2240-9"
}