Detail publikace

Possibilities of making 3D resistors in LTCC technology

Originální název

Possibilities of making 3D resistors in LTCC technology

Anglický název

Possibilities of making 3D resistors in LTCC technology

Jazyk

en

Originální abstrakt

The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.

Anglický abstrakt

The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.

BibTex


@inproceedings{BUT93108,
  author="Martin {Klíma} and Ivan {Szendiuch}",
  title="Possibilities of making 3D resistors in LTCC technology",
  annote="The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on  finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.",
  booktitle="Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology",
  chapter="93108",
  howpublished="online",
  year="2012",
  month="august",
  pages="50--54",
  type="conference paper"
}