Detail publikace

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Originální název

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Anglický název

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Jazyk

en

Originální abstrakt

Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process – wetting phenomena

Anglický abstrakt

Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process – wetting phenomena

BibTex


@inproceedings{BUT8886,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere",
  annote="Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process – wetting phenomena",
  address="VUT v Brně",
  booktitle="Electronic Devices and Systems EDS 03",
  chapter="8886",
  institution="VUT v Brně",
  year="2003",
  month="january",
  pages="438",
  publisher="VUT v Brně",
  type="conference paper"
}