Detail publikace

Cheep Solution for MSM (MMS)

Originální název

Cheep Solution for MSM (MMS)

Anglický název

Cheep Solution for MSM (MMS)

Jazyk

en

Originální abstrakt

Multisubstrate modeles are new solution in 3D package construction. There are some new principles described in this paper

Anglický abstrakt

Multisubstrate modeles are new solution in 3D package construction. There are some new principles described in this paper

BibTex


@inproceedings{BUT8713,
  author="Josef {Šandera} and Ivan {Szendiuch}",
  title="Cheep Solution for MSM (MMS)",
  annote="Multisubstrate modeles are new solution in 3D package construction. There are some new principles described in this paper",
  address="IMAPS Germany",
  booktitle="14th European Microelectronics and Packaging Conference",
  chapter="8713",
  institution="IMAPS Germany",
  journal="IMAPS Europe",
  year="2003",
  month="june",
  pages="436",
  publisher="IMAPS Germany",
  type="conference paper"
}