Detail publikace

Modelling of 3D Multimodule Substrate

Originální název

Modelling of 3D Multimodule Substrate

Anglický název

Modelling of 3D Multimodule Substrate

Jazyk

en

Originální abstrakt

Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.

Anglický abstrakt

Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.

BibTex


@inproceedings{BUT8127,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Modelling of 3D Multimodule Substrate",
  annote="Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution.  This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.",
  address="International Microelectronics and Packaging Society Poland-Chapter",
  booktitle="Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003",
  chapter="8127",
  edition="Neuveden",
  institution="International Microelectronics and Packaging Society Poland-Chapter",
  year="2003",
  month="january",
  pages="126",
  publisher="International Microelectronics and Packaging Society Poland-Chapter",
  type="conference paper"
}