Detail publikace

Odborný posudek - Konečné vyjádření:IEC 60068-2-58, Ed.3 – 91/447/FDIS IEC 60068-2-58, Ed.3: Environmental testing - Part: 2-58: Tests - Test Td - Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

STARÝ, J.

Originální název

Odborný posudek - Konečné vyjádření:IEC 60068-2-58, Ed.3 – 91/447/FDIS IEC 60068-2-58, Ed.3: Environmental testing - Part: 2-58: Tests - Test Td - Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Český název

Odborný posudek - Konečné vyjádření:IEC 60068-2-58, Ed.3 – 91/447/FDIS IEC 60068-2-58, Ed.3: Environmental testing - Part: 2-58: Tests - Test Td - Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Typ

norma

Jazyk

cs

Vydáno

25.01.2004

Strany od

1

Strany do

2

Strany počet

2

BibTex


@misc{BUT67780,
  author="Jiří {Starý}",
  title="Odborný posudek - Konečné vyjádření:IEC 60068-2-58, Ed.3 – 91/447/FDIS IEC 60068-2-58, Ed.3: Environmental testing - Part: 2-58: Tests - Test Td - Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)",
  chapter="67780",
  year="2004",
  month="january",
  pages="1",
  type="standard"
}