Detail publikace

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

Originální název

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

Anglický název

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

Jazyk

en

Originální abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Anglický abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

BibTex


@misc{BUT61103,
  author="Michal {Nicák} and Olga {Švecová} and Jiří {Pulec} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures",
  annote="This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.",
  address="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  booktitle="6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet",
  chapter="61103",
  edition="1",
  institution="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  year="2010",
  month="june",
  pages="184--184",
  publisher="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  type="abstract"
}