Detail publikace

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

NICÁK, M. ŠVECOVÁ, O. PULEC, J. ŠANDERA, J. SZENDIUCH, I.

Originální název

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

Typ

abstrakt

Jazyk

angličtina

Originální abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Klíčová slova

Reliability, Lead-free, Solder ball, 3D

Autoři

NICÁK, M.; ŠVECOVÁ, O.; PULEC, J.; ŠANDERA, J.; SZENDIUCH, I.

Vydáno

28. 6. 2010

Nakladatel

VUT Brno, FSI & Repropress, Srbská 53, Brno

Místo

Brno

ISBN

978-80-214-4112-5

Kniha

6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet

Edice

1

Strany od

184

Strany do

184

Strany počet

1

BibTex

@misc{BUT61103,
  author="Michal {Nicák} and Olga {Švecová} and Jiří {Pulec} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures",
  booktitle="6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet",
  year="2010",
  series="1",
  pages="184--184",
  publisher="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  address="Brno",
  isbn="978-80-214-4112-5",
  note="abstract"
}