Detail publikace

Influence of the CTE on Mechanical Stress of Chip SMD Components

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Influence of the CTE on Mechanical Stress of Chip SMD Components

Anglický název

Influence of the CTE on Mechanical Stress of Chip SMD Components

Jazyk

en

Originální abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Anglický abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Dokumenty

BibTex


@inproceedings{BUT5119,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Influence of the CTE on Mechanical Stress of Chip SMD Components",
  annote="This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.",
  booktitle="Socrates Workshop 2002 - Proceedings",
  chapter="5119",
  year="2002",
  month="january",
  pages="92",
  type="conference paper"
}