Detail publikace

MSM realized by Thick Film Technology

Originální název

MSM realized by Thick Film Technology

Anglický název

MSM realized by Thick Film Technology

Jazyk

en

Originální abstrakt

Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.

Anglický abstrakt

Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.

BibTex


@inproceedings{BUT4949,
  author="Ivan {Szendiuch}",
  title="MSM realized by Thick Film Technology",
  annote="Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.",
  address="Vysoké učení technické v Brně",
  booktitle="ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS",
  chapter="4949",
  institution="Vysoké učení technické v Brně",
  year="2002",
  month="january",
  pages="211",
  publisher="Vysoké učení technické v Brně",
  type="conference paper"
}