Detail publikace

Material Compatibility and Process Optimization in Lead Free Soldering

Originální název

Material Compatibility and Process Optimization in Lead Free Soldering

Anglický název

Material Compatibility and Process Optimization in Lead Free Soldering

Jazyk

en

Originální abstrakt

Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.

Anglický abstrakt

Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.

BibTex


@inproceedings{BUT4276,
  author="Jiří {Starý}",
  title="Material Compatibility and Process Optimization in Lead Free Soldering",
  annote="Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.",
  booktitle="Socrates Workshop 2002- Proceedings.Intensive Training Programme in Electronic System Design.",
  chapter="4276",
  year="2002",
  month="november",
  pages="200",
  type="conference paper"
}