Detail publikace

Trends in Packaging and Lead-free Solders

Originální název

Trends in Packaging and Lead-free Solders

Anglický název

Trends in Packaging and Lead-free Solders

Jazyk

en

Originální abstrakt

Modern Trend in Packaging with application of Pb-free solders are described in this paper

Anglický abstrakt

Modern Trend in Packaging with application of Pb-free solders are described in this paper

BibTex


@article{BUT41776,
  author="Ivan {Szendiuch}",
  title="Trends in Packaging and Lead-free Solders",
  annote="Modern Trend in Packaging with application of Pb-free solders are described in this paper",
  address="SMT info konsorcium",
  booktitle="SDMT info Bulletin",
  chapter="41776",
  edition="43/2003",
  institution="SMT info konsorcium",
  journal="Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"",
  number="43",
  volume="2003",
  year="2003",
  month="october",
  pages="3",
  publisher="SMT info konsorcium",
  type="journal article"
}