Detail publikace

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Originální název

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Anglický název

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Jazyk

en

Originální abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Anglický abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

BibTex


@inproceedings{BUT36015,
  author="Michal {Nicák} and Olga {Švecová} and Josef {Šandera} and Jiří {Pulec} and Ivan {Szendiuch}",
  title="Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure",
  annote="This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure.
There are plenty of factors which influences reliability and life-time of solder compound
connection. Type of substrates, selection of materials and process arrangement are the main areas to
investigate. The content consists from three main parts. The first deals with introduction of designed
test pattern, material, and process arrangement and applied testing methods. Second part continues
with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests
and third part is aimed to experimental evaluation of results in the comparison to simulated results.",
  address="Trans Tech Publications",
  booktitle="Key Engineering Materials Vol. 465 (2011)",
  chapter="36015",
  howpublished="print",
  institution="Trans Tech Publications",
  number="491",
  year="2011",
  month="january",
  pages="491--494",
  publisher="Trans Tech Publications",
  type="conference paper"
}