Detail publikace

Levné 3-D pouzdření a multimodulové struktury

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Levné 3-D pouzdření a multimodulové struktury

Český název

Levné 3-D pouzdření a multimodulové struktury

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

cs

Originální abstrakt

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Český abstrakt

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Rok RIV

2004

Vydáno

01.01.2001

Nakladatel

Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105

Místo

Brno

ISBN

80-214-1960-1

Kniha

8th Electronic Devices and Systems Conference 2001

Strany od

199

Strany do

204

Strany počet

5

Dokumenty

BibTex


@inproceedings{BUT3338,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Levné 3-D pouzdření a multimodulové struktury",
  annote="Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.",
  address="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  booktitle="8th Electronic Devices and Systems Conference 2001",
  chapter="3338",
  howpublished="print",
  institution="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  year="2001",
  month="january",
  pages="199--204",
  publisher="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  type="conference paper"
}