Detail publikace

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

Originální název

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

Anglický název

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

Jazyk

en

Originální abstrakt

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator

Anglický abstrakt

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator

BibTex


@inproceedings{BUT26554,
  author="Pavel {Tofel} and Vlasta {Sedláková} and Josef {Šikula}",
  title="Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal",
  annote="The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005   to 1  , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator",
  booktitle="Reliability and Life-time Prediction ISSE2008",
  chapter="26554",
  edition="1",
  howpublished="print",
  year="2008",
  month="may",
  pages="56--57",
  type="conference paper"
}