Detail publikace
Simulation of different substrates connection
Novotný, M., Szendiuch, I.
Originální název
Simulation of different substrates connection
Anglický název
Simulation of different substrates connection
Jazyk
en
Originální abstrakt
This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.
Anglický abstrakt
This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.
Dokumenty
BibTex
@inproceedings{BUT24669,
author="Marek {Novotný} and Ivan {Szendiuch}",
title="Simulation of different substrates connection",
annote="This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.",
address="VUT Brno",
booktitle="Proceedings EDS '06",
chapter="24669",
institution="VUT Brno",
year="2006",
month="january",
pages="499",
publisher="VUT Brno",
type="conference paper"
}