Detail publikace

Simulation of different substrates connection

Originální název

Simulation of different substrates connection

Anglický název

Simulation of different substrates connection

Jazyk

en

Originální abstrakt

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

Anglický abstrakt

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

BibTex


@inproceedings{BUT24669,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Simulation of different substrates connection",
  annote="This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.",
  address="VUT Brno",
  booktitle="Proceedings EDS '06",
  chapter="24669",
  institution="VUT Brno",
  year="2006",
  month="january",
  pages="499",
  publisher="VUT Brno",
  type="conference paper"
}