Detail publikace

Chip Power Interconnection

Originální název

Chip Power Interconnection

Anglický název

Chip Power Interconnection

Jazyk

en

Originální abstrakt

This paper describes themomechanical modeling of chip interconnection.

Anglický abstrakt

This paper describes themomechanical modeling of chip interconnection.

BibTex


@inproceedings{BUT22762,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Chip Power Interconnection",
  annote="This paper describes themomechanical modeling of chip interconnection.",
  address="TU of Cluj Napoca",
  booktitle="Proceeding of 30th International Spring Seminar on Electronics Technology",
  chapter="22762",
  institution="TU of Cluj Napoca",
  year="2007",
  month="january",
  pages="183",
  publisher="TU of Cluj Napoca",
  type="conference paper"
}