Detail publikace

Realization and Simulation of Interconnection of Solar Cell

Originální název

Realization and Simulation of Interconnection of Solar Cell

Anglický název

Realization and Simulation of Interconnection of Solar Cell

Jazyk

en

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Anglický abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

BibTex


@inproceedings{BUT21051,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Realization and Simulation of Interconnection of Solar Cell",
  annote="This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and  lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.",
  address="Prof. Vítězslav Benda, PhD.",
  booktitle="3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS",
  chapter="21051",
  institution="Prof. Vítězslav Benda, PhD.",
  year="2006",
  month="january",
  pages="119",
  publisher="Prof. Vítězslav Benda, PhD.",
  type="conference paper"
}