Detail publikace

Reliability of solar cell´s solder joints

Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.

Originální název

Reliability of solar cell´s solder joints

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This work is about reliability of solar cell´s solder joints. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Klíčová slova v angličtině

Reliability, Interconnection, Back Side Contact Solar Cell, ANSYS

Autoři

Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.

Rok RIV

2006

Vydáno

1. 1. 2006

Nakladatel

Heinz Wohlrabe

Místo

Dresden

ISBN

3-934142-23-0

Kniha

Proceeding of ISSE 2006

Číslo edice

první

Strany od

72

Strany do

76

Strany počet

5

BibTex

@inproceedings{BUT18687,
  author="Luboš {Jakubka} and Marek {Novotný} and Jiří {Hladík} and Ivan {Szendiuch}",
  title="Reliability of solar cell´s solder joints",
  booktitle="Proceeding of ISSE 2006",
  year="2006",
  number="první",
  pages="5",
  publisher="Heinz Wohlrabe",
  address="Dresden",
  isbn="3-934142-23-0"
}