Detail publikace

Comparing of flip-chip and wire-bonding interconnection

Originální název

Comparing of flip-chip and wire-bonding interconnection

Anglický název

Comparing of flip-chip and wire-bonding interconnection

Jazyk

en

Originální abstrakt

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

Anglický abstrakt

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

BibTex


@inproceedings{BUT18686,
  author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}",
  title="Comparing of flip-chip and wire-bonding interconnection",
  annote="This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.",
  address="TU Dresden",
  booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006",
  chapter="18686",
  institution="TU Dresden",
  year="2006",
  month="january",
  pages="67",
  publisher="TU Dresden",
  type="conference paper"
}