Detail publikace

Comparing of 2D and 3D Modeling of MSM

Originální název

Comparing of 2D and 3D Modeling of MSM

Anglický název

Comparing of 2D and 3D Modeling of MSM

Jazyk

en

Originální abstrakt

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.

Anglický abstrakt

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.

BibTex


@inproceedings{BUT16786,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Comparing of 2D and 3D Modeling of MSM",
  annote="This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).
In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.",
  address="IEEE",
  booktitle="2005 Spanish Conference on Electron Devices",
  chapter="16786",
  institution="IEEE",
  year="2005",
  month="february",
  pages="1",
  publisher="IEEE",
  type="conference paper"
}